Here are details, I also included the 1 reference lecture slide and project sample (but project sample is for different topic). I need 4 pages on this not including the reference page.
Project#3 3D Packaging
Chip on Chip, Wafer on Wafer, Package on Package stacking, interconnects like Though Silicon Vias, Through Package Vias, Assembly/processes, advantages/disadvantages etc
Literature review summary (with at least 8 references)
Challenges foreseen connecting to technology demands and/or Applications , at least one
new/emerging concept needs to be discussed at length.
Minimum Four pages ( max 6 pages) write-up – references need to be on the additional page
Format: Introduction, Description of the technology, Uniqueness, Advantages/Disadvantages, Discussion/Inference, Conclusions & recommendations for future work, References.
Font size Times New Roman 12, Heading and subheadings in bold.
Delivering a high-quality product at a reasonable price is not enough anymore.
That’s why we have developed 5 beneficial guarantees that will make your experience with our service enjoyable, easy, and safe.
You have to be 100% sure of the quality of your product to give a money-back guarantee. This describes us perfectly. Make sure that this guarantee is totally transparent.Read more
Each paper is composed from scratch, according to your instructions. It is then checked by our plagiarism-detection software. There is no gap where plagiarism could squeeze in.Read more
Thanks to our free revisions, there is no way for you to be unsatisfied. We will work on your paper until you are completely happy with the result.Read more
Your email is safe, as we store it according to international data protection rules. Your bank details are secure, as we use only reliable payment systems.Read more
By sending us your money, you buy the service we provide. Check out our terms and conditions if you prefer business talks to be laid out in official language.Read more