Topics Mechanical Engineering – IC Packaging ( 3D packaging) project report

Here are details, I also included the 1 reference lecture slide and project sample (but project sample is for different topic). I need 4 pages on this not including the reference page. 

Project#3 3D  Packaging  
Chip on Chip, Wafer on Wafer, Package on Package stacking, interconnects like  Though Silicon Vias, Through Package Vias,  Assembly/processes, advantages/disadvantages  etc  

•Literature review  summary (with at least 8 references)
•Challenges foreseen connecting to technology demands and/or  Applications , at least one
 new/emerging concept needs to be discussed at length.
•Minimum Four pages ( max 6 pages)  write-up – references need to be on the additional page
•Format:  Introduction, Description of the technology, Uniqueness, Advantages/Disadvantages, Discussion/Inference, Conclusions & recommendations for future work, References. 
Font size  Times New Roman 12,  Heading and subheadings in bold.

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550 words
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